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Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) ProgramIn order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.
Document ID
19960054130
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Koester, D. A.
(Microelectronics Center of North Carolina Research Triangle Park, NC United States)
Markus, K. W.
(Microelectronics Center of North Carolina Research Triangle Park, NC United States)
Dhuler, V.
(Microelectronics Center of North Carolina Research Triangle Park, NC United States)
Mahadevan, R.
(Microelectronics Center of North Carolina Research Triangle Park, NC United States)
Cowen, A.
(Microelectronics Center of North Carolina Research Triangle Park, NC United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1995
Publication Information
Publication: Proceedings of the International Conference on Integrated Micro/Nanotechnology for Space Applications
Subject Category
Engineering (General)
Accession Number
96N36376
Funding Number(s)
CONTRACT_GRANT: DABT63-93-C-0051
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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