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Refractory Ceramic Foams for Novel ApplicationsWorkers at NASA Ames Research center are endeavoring to develop durable, oxidation-resistant, foam thermal protection systems (TPSs) that would be suitable for covering large exterior spacecraft surfaces, would have low to moderate densities, and would have temperature capabilities comparable to those of carbon-based TPSs [reusable at 3,000 F (.1,650 C)] with application of suitable coatings. These foams may also be useful for repairing TPSs while in orbit. Moreover, on Earth as well as in outer space, these foams might be useful as catalyst supports and filters. Preceramic polymers are obvious candidates for use in making the foams in question. The use of these polymers offers advantages over processing routes followed in making conventional ceramics. Among the advantages are the ability to plastically form parts, the ability to form pyrolized ceramic materials at lower temperatures, and the ability to form high-purity microstructures having properties that can be tailored to satisfy requirements. Heretofore, preceramic polymers have been used mostly in the production of such low-dimensional products as fibers because the loss of volatiles during pyrolysis of the polymers leads to porosity and large shrinkage (in excess of 30 percent). In addition, efforts to form bulk structures from preceramic polymers have resulted in severe cracking during pyrolysis. However, because the foams in question would consist of networks of thin struts (in contradistinction to nonporous dense solids), these foams are ideal candidates for processing along a preceramic-polymer route.
Document ID
20090017542
Acquisition Source
Ames Research Center
Document Type
Other - NASA Tech Brief
Authors
Stackpoole, M.
(Eloret Corp. Moffett Field, CA, United States)
Date Acquired
August 24, 2013
Publication Date
May 1, 2008
Publication Information
Publication: NASA Tech Briefs, May 2008
Subject Category
Technology Utilization And Surface Transportation
Report/Patent Number
ARC-15260-1
Distribution Limits
Public
Copyright
Public Use Permitted.
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