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Development of beam leaded low power logic circuitsThe technologies of low power TTL and beam lead processing were merged into a single product family. This family offers the power and thermal advantages of low power(54L), while providing the additional reliability advantages of beam leads. The reduction in the power and heat levels also allows the system designer to take advantage, through beam lead, multichip assemblies, of increased package density to reduce system size and weight.
Document ID
19720020596
Document Type
Contractor Report (CR)
Authors
Smith, B. W. (Texas Instruments, Inc. Dallas, TX, United States)
Malone, F. (Texas Instruments, Inc. Dallas, TX, United States)
Date Acquired
September 2, 2013
Publication Date
March 1, 1972
Subject Category
ELECTRONICS
Report/Patent Number
REPT-03-72-27
NASA-CR-112099
Funding Number(s)
CONTRACT_GRANT: NAS1-10532
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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NameType 19720020596.pdf STI