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Ion beam sputter etching and deposition of fluoropolymersFluoropolymer etching and deposition techniques including thermal evaporation, RF sputtering, plasma polymerization, and ion beam sputtering are reviewed. Etching and deposition mechanism and material characteristics are discussed. Ion beam sputter etch rates for polytetrafluoroethylene (PTFE) were determined as a function of ion energy, current density and ion beam power density. Peel strengths were measured for epoxy bonds to various ion beam sputtered fluoropolymers. Coefficients of static and dynamic friction were measured for fluoropolymers deposited from ion bombarded PTFE.
Document ID
19780016415
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Banks, B. A.
(NASA Lewis Research Center Cleveland, OH, United States)
Sovey, J. S.
(NASA Lewis Research Center Cleveland, OH, United States)
Miller, T. B.
(NASA Lewis Research Center Cleveland, OH, United States)
Crandall, K. S.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 3, 2013
Publication Date
January 1, 1978
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-78888
Meeting Information
Meeting: Intern. Conf. on Electron and Ion Beam Sci. and Tech.
Location: Seattle
Start Date: May 21, 1978
End Date: May 26, 1978
Sponsors: Electrochemical Soc., Inc.
Accession Number
78N24358
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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