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The Thermal Electrical Conductivity Probe (TECP) for PhoenixThe Thermal and Electrical Conductivity Probe (TECP) is a component of the Microscopy, Electrochemistry, and Conductivity Analyzer (MECA) payload on the Phoenix Lander. TECP will measure the temperature, thermal conductivity and volumetric heat capacity of the regolith. It will also detect and quantify the population of mobile H2O molecules in the regolith, if any, throughout the polar summer, by measuring the electrical conductivity of the regolith, as well as the dielectric permittivity. In the vapor phase, TECP is capable of measuring the atmospheric H2O vapor abundance, as well as augment the wind velocity measurements from the meteorology instrumentation. TECP is mounted near the end of the 2.3 m Robotic Arm, and can be placed either in the regolith material or held aloft in the atmosphere. This paper describes the development and calibration of the TECP. In addition, substantial characterization of the instrument has been conducted to identify behavioral characteristics that might affect landed surface operations. The greatest potential issue identified in characterization tests is the extraordinary sensitivity of the TECP to placement. Small gaps alter the contact between the TECP and regolith, complicating data interpretation. Testing with the Phoenix Robotic Arm identified mitigation techniques that will be implemented during flight. A flight model of the instrument was also field tested in the Antarctic Dry Valleys during the 2007-2008 International Polar year. 2
Document ID
20090033138
Acquisition Source
Ames Research Center
Document Type
Preprint (Draft being sent to journal)
Authors
Zent, Aaron P.
(NASA Ames Research Center Moffett Field, CA, United States)
Hecht, Michael H.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Cobos, Doug R.
(Decagon Devices, Inc. Pullman, WA, United States)
Campbell, Gaylon S.
(Decagon Devices, Inc. Pullman, WA, United States)
Campbell, Colin S.
(Decagon Devices, Inc. Pullman, WA, United States)
Cardell, Greg
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Foote, Marc C.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Wood, Stephen E.
(Washington Univ. Seattle, WA, United States)
Mehta, Manish
(Michigan Univ. Ann Arbor, MI, United States)
Date Acquired
August 24, 2013
Publication Date
January 1, 2009
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
ARC-E-DAA-TN264
Funding Number(s)
WBS: WBS 439654.02.01.03
Distribution Limits
Public
Copyright
Public Use Permitted.
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