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Yearlong 500 °C Operational Demonstration of Up-Scaled 4H-SiC JFET Integrated CircuitsThis work describes recent progress in the design, processing, upscaling, and testing of 500°C durable two-level interconnect 4H-SiC JFET IC technology undergoing development at NASA Glenn Research Center. For the first time, stable electrical operation of semiconductor ICs for 1 year (8760 hours) at 500°C in air atmosphere is reported. These groundbreaking durability results were attained on two-level interconnect JFET demonstration ICs with 175 or more transistors on each chip. This corresponds to a more than 7-fold increase in 500°C-durable circuit complexity from the 24 transistor ring oscillator ICs reported at HiTEC 2016.
Document ID
20190001885
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Neudeck, Philip G.
(NASA Glenn Research Center Cleveland, OH, United States)
Spry, David J.
(NASA Glenn Research Center Cleveland, OH, United States)
Krasowski, Michael J.
(NASA Glenn Research Center Cleveland, OH, United States)
Prokop, Norman F.
(NASA Glenn Research Center Cleveland, OH, United States)
Beheim, Glenn M.
(NASA Glenn Research Center Cleveland, OH, United States)
Chen, Liang-Yu
(Ohio Aerospace Inst. Cleveland, OH, United States)
Chang, Carl W.
(Vantage Partners, LLC Brook Park, OH, United States)
Date Acquired
March 26, 2019
Publication Date
May 8, 2018
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GRC-E-DAA-TN56142
Meeting Information
Meeting: International Conference and Exhibition on High Temperature Electronics (HiTEC 2018)
Location: Albuquerque, NM
Country: United States
Start Date: May 8, 2018
End Date: May 10, 2018
Sponsors: International Microelectronics Assembly and Packaging Society (iMAPS)
Funding Number(s)
WBS: WBS 109492.02.03.02
CONTRACT_GRANT: NNC13BA10B
CONTRACT_GRANT: NNC12BA01B
Distribution Limits
Public
Copyright
Public Use Permitted.
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