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Solder-circuitry separation problems associated with plated printed circuit boardsInvestigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate
Document ID
19710015239
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Pasciak, A. M. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Date Acquired
September 2, 2013
Publication Date
May 1, 1971
Subject Category
Electronic Equipment
Report/Patent Number
M-655
NASA-TM-X-2290
Report Number: M-655
Report Number: NASA-TM-X-2290
Accession Number
71N24715
Funding Number(s)
CONTRACT_GRANT: NAS8-20081
CONTRACT_GRANT: 933-50-07-00-62
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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