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Glass encapsulation provides extra protection for IC semiconductor devicesOxide-passivated semiconductor chip is given protective glass coating by means of vapor deposition over metallic substrate of integrated circuit (IC). Method provides more reliable oxide-passivation and hermetic sealing in current use. Chips and scratches incurred during dicing, testing, and assembly are markedly reduced.
Document ID
19730000054
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Doelp, W. L., Jr. (Philco-Ford Corp.)
Date Acquired
August 7, 2013
Publication Date
January 1, 1973
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-21310
Report Number: MFS-21310
Accession Number
73B10054
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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