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Friction transition in polyimide films as related to molecular relaxations and structureThe friction characteristics of polyimide films bonded to metallic substrates were studied from 25 to 500 C. These results were correlated to molecular structure and the results of torsional braid analysis (TBA). A large friction transition (0.23 to 0.03) was found to occur at 45 C + or - 5 C. It was postulated that this transition was initiated by some molecular relaxation, which gave the molecules a degree of freedom by which an external mechanical stress could rearrange the molecules into a structure, such as an extended chain, which is conducive to easy shear. Above 300 C the friction characteristics were found to be dependent on the thermal prehistory of the film.
Document ID
19750012491
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Technical Note (TN)
Authors
Fusaro, R. L.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 3, 2013
Publication Date
April 1, 1975
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TN-D-7954
E-8021
Accession Number
75N20563
Funding Number(s)
PROJECT: RTOP 505-04
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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