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Array automated assembly, phase 2An analysis was made of cost tradeoffs for shaping modified square wafers from cylindrical crystals. Tests were conducted of the effectiveness of texture etching for removal of surface damage on sawed wafers. A single step texturing etch appeared adequate for removal of surface damage on wafers cut with multiple blade reciprocating slurry saws.
Document ID
19780016707
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Taylor, W. E. (Spectrolab, Inc. Sylmar, CA, United States)
Date Acquired
September 3, 2013
Publication Date
February 1, 1978
Subject Category
Energy Production And Conversion
Report/Patent Number
NASA-CR-157057
DOE/JPL-954853-78/1
Report Number: NASA-CR-157057
Report Number: DOE/JPL-954853-78/1
Accession Number
78N24650
Funding Number(s)
CONTRACT_GRANT: JPL-954853
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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