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Development of test methodology for dynamic mechanical analysis instrumentationDynamic mechanical analysis instrumentation was used for the development of specific test methodology in the determination of engineering parameters of selected materials, esp. plastics and elastomers, over a broad range of temperature with selected environment. The methodology for routine procedures was established with specific attention given to sample geometry, sample size, and mounting techniques. The basic software of the duPont 1090 thermal analyzer was used for data reduction which simplify the theoretical interpretation. Clamps were developed which allowed 'relative' damping during the cure cycle to be measured for the fiber-glass supported resin. The correlation of fracture energy 'toughness' (or impact strength) with the low temperature (glassy) relaxation responses for a 'rubber-modified' epoxy system was negative in result because the low-temperature dispersion mode (-80 C) of the modifier coincided with that of the epoxy matrix, making quantitative comparison unrealistic.
Document ID
19830009091
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Allen, V. R.
(Tennessee Technological Univ. Cookeville, TN, United States)
Date Acquired
August 11, 2013
Publication Date
August 1, 1982
Publication Information
Publication: NASA. Marshall Space Flight Center The 1982 NASA(ASEE Summer Fac. Fellowship Program
Subject Category
Instrumentation And Photography
Accession Number
83N17362
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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