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Solar cell and I.C. aspects of ingot-to-slice mechanical processingIntensive efforts have been put into the growth of silicon crystals to suit today's solar cell and integrated circuit requirements. Each step of processing the crystal must also receive concentrated attention to preserve the grown-in perfection and to provide a suitable device-ready wafer at reasonable cost. A comparison is made between solar cell and I.C. requirements on the mechanical processing of silicon from ingot to wafer. Specific defects are described that can ruin the slice or can possibly lead to device degradation. These include grinding cracks, saw exit chips, crow's-foot fractures, edge cracks, and handling scratches.
Document ID
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Dyer, L. D.
(Texas Instruments, Inc. Sherman, TX, United States)
Date Acquired
August 12, 2013
Publication Date
August 15, 1985
Publication Information
Publication: JPL Proceedings of the Flat-Plate Solar Array Project Workshop
Subject Category
Solid-State Physics
Accession Number
Distribution Limits
Work of the US Gov. Public Use Permitted.
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