High-temperature strain measurement techniques: Current developments and challenges

Since 1987, a very substantial amount of R&D has been conducted in an attempt to develop reliable strain sensors for the measurements of structural strains during ground testing and hypersonic flight, at temperatures up to at least 2000 deg F. Much of the effort has been focused on requirements of the NASP Program. This presentation is limited to the current sensor development work and characterization studies carried out within that program. It is basically an assessment as to where we are now and what remains to be done in the way of technical accomplishments to meet the technical challenges posed by the requirements and constraints established for the NASP Program. The approach for meeting those requirements and constraints has been multi-disciplinary in nature. It was recognized early on that no one sensor could meet all these requirements and constraints, largely because of the large temperature range (cryogenic to at least 2000 deg F) and many other factors, including the most challenging requirement that the sensor system be capable of obtaining valid 'first cycle data'. Present candidate alloys for resistance-type strain gages include Fe-Cr-Al and Pd-Cr. Although they have superior properties regarding withstanding very high temperatures, they exhibit large apparent strains that must either be accounted for or cancelled out by various techniques, including the use of a dual-element, half-bridge dummy gage, or electrical compensation networks. A significant effort is being devoted to developing, refining, and evaluating the effectiveness of those techniques over a broad range in temperature and time. In the quest to obtain first-cycle data, ways must be found to eliminate the need to prestabilize or precondition the strain gage, before it is attached to the test article. It should be noted that present NASP constraints do not permit prestabilization of the sensor, in situ. Gages are currently being 'heat treated' during manufacture in both the wire- and foil-type resistance strain gages, and evaluation is in progress. In addition, the 'gage-on-shim' concept is being revisited. That concept will permit heat treatment of the gage during manufacture, before attachment on the test article. Also, it may permit the individual calibration of each gage regarding gage factor and apparent strain. Candidate alloys for the NASP include titanium metal-matrix and carbon-carbon composites. Although those materials have very attractive properties at elevated temperatures in terms of strength and weight, they pose significant attachment problems. Methods for making reliable strain gage and thermocouple attachments to them are currently under development. Experience to date indicates that Rokide attachment of the sensor directly to the protective coating is easier than to the base material itself. However, interpreting strain data from gages attached in this way may prove difficult because of possible cracks in the coating that form 'islands' and the mobility of those 'islands'. It is concluded, therefore, that major technical challenges lie ahead as we proceed to meet the stringent strain sensor requirements and constraints of the NASP Program.