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Binary tree eigen solver in finite element analysisThis paper presents a transputer-based binary tree eigensolver for the solution of the generalized eigenproblem in linear elastic finite element analysis. The algorithm is based on the method of recursive doubling, which parallel implementation of a number of associative operations on an arbitrary set having N elements is of the order of o(log2N), compared to (N-1) steps if implemented sequentially. The hardware used in the implementation of the binary tree consists of 32 transputers. The algorithm is written in OCCAM which is a high-level language developed with the transputers to address parallel programming constructs and to provide the communications between processors. The algorithm can be replicated to match the size of the binary tree transputer network. Parallel and sequential finite element analysis programs have been developed to solve for the set of the least-order eigenpairs using the modified subspace method. The speed-up obtained for a typical analysis problem indicates close agreement with the theoretical prediction given by the method of recursive doubling.
Document ID
19930050037
Document Type
Conference Paper
Authors
Akl, F. A. (Louisiana Tech Univ. Ruston, United States)
Janetzke, D. C. (NASA Lewis Research Center Cleveland, OH, United States)
Kiraly, L. J. (NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
August 16, 2013
Publication Date
January 1, 1993
Publication Information
Publication: In: AIAA(ASME)ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 34th and AIAA/ASME Adaptive Structures Forum, La Jolla, CA, Apr. 19-22, 1993, Technical Papers. Pt. 3 (A93-33876 1
Subject Category
NUMERICAL ANALYSIS
Report/Patent Number
AIAA PAPER 93-1493
Distribution Limits
Public
Copyright
Other

Related Records

IDRelationTitle19930049879Analytic PrimaryAIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference, 34th and AIAA/ASME Adaptive Structures Forum, La Jolla, CA, Apr. 19-22, 1993, Technical Papers. Pts. 1-6