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Making a Back-Illuminated Imager with Back-Side Contact and Alignment MarkersA design modification and a fabrication process that implements the modification have been conceived to solve two problems encountered in the development of back-illuminated, back-sidethinned complementary metal oxide/ semiconductor (CMOS) image-detector integrated circuits. The two problems are (1) how to form metal electrical-contact pads on the back side that are electrically connected through the thickness in proper alignment with electrical contact points on the front side and (2) how to provide alignment keys on the back side to ensure proper registration of backside optical components (e.g., microlenses and/or color filters) with the front-side pixel pattern. The essence of the design modification is to add metal plugs that extend from the desired front-side locations through the thickness and protrude from the back side of the substrate. The plugs afford the required front-to-back electrical conduction, and the protrusions of the plugs serve as both the alignment keys and the bases upon which the back-side electrical-contact pads can be formed.
Document ID
20090011266
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - NASA Tech Brief
Authors
Pain, Bedabrata
(California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 24, 2013
Publication Date
July 1, 2008
Publication Information
Publication: NASA Tech Briefs, July 2008
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
NPO-42839
Distribution Limits
Public
Copyright
Public Use Permitted.
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