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Capacitor Test, Evaluation. and Modeling Within NASA Electronic Parts and Packaging (NEPP) Program. "Why Ceramic Capacitors Fracture During Manual Soldering and How to Avoid Failures"Presentation discusses: (1) Why Multi-Layer Ceramic Capacitors(MLCCs) crack during manual soldering? Workmanship and parts issues. (2) Do existing qualification requirements assure crack-free soldering? MIL-spec Thermal Shock (TS) testing. MIL-spec Resistance to Soldering Heat (RSH) test. (3) What test can assure reliable soldering? Mechanical characteristics of ceramics. Comparison of three TS techniques: LND, TSD, and IWT. (4) Simulation of TS conditions.
Document ID
20110023455
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Teverovsky, Alexander (NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 25, 2013
Publication Date
June 1, 2011
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GSFC.DPW.5350.2011
Report Number: GSFC.DPW.5350.2011
Meeting Information
Meeting: NASA Electronic Parts and Packaging (NEPP) Program Electronic Technology Workshop (ETW) 2011
Location: Greenbelt, MD
Country: United States
Start Date: June 1, 2011
Distribution Limits
Public
Copyright
Public Use Permitted.

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