Advanced Modular Power System Fully Populated Electronics Enclosure Thermal Testing

A thermal test of an enclosure housing the AMPS electronics cards was performed. The enclosure was fully populated with 17 nonfunctioning AMPS electronics cards. Heaters were applied to the cards to simulate their operation. A cold plate was installed on the top of the case. The case was then insulated to simulate its installation within an electronics rack with the face and rear of the enclosure left open. The cold plate was connected to a chiller which provided cooling water at a fixed input temperature to the cold plate. Flow rates from the chiller of 0.0 L/min, 1.4 L/min and 1.8 L/min were tested. The test was operated at each flow rate over a range of heater power levels until the steady state temperature of the electronics cards was reached. Heater power levels from 2.5 W/card to 45 W/card were tested. The data collected was used to determine the steady state operating temperature of the cards, the temperature distribution between the cards, the time to reach steady-state temperature, the change in steady state temperature with change in heater power, the temperature distribution between the cards at the steady state condition and the heat lost to the surrounds by the enclosure. One of the main goals of the testing was to determine how much waste heat the cards could generate and still maintain a touch temperature at or below 40°C. Based on this requirement, for the 3 cooling rates tested, the maximum card waste heat that could be generated by each individual card was 3.9 W, 16.3 W and 17.6 W respectively. An analysis was also set up to provide an analytical model to estimate the card temperature under different cold plate flow rates and card heater power levels. The results off the analysis was compared to that of the experiment of the range of flow rates and power levels tested.