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Alternative Setup for Long-Duration Low-Duty-Cycle 600 °C Ambient Testing of SiC Integrated Circuits
Document ID
20210011837
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Alain Izadnegahdar (Science Applications International Corporation (United States) McLean, Virginia, United States)
Stephanie L. Booth (Glenn Research Center Cleveland, Ohio, United States)
David J. Spry (Glenn Research Center Cleveland, Ohio, United States)
Philip G. Neudeck (Glenn Research Center Cleveland, Ohio, United States)
Date Acquired
March 24, 2021
Subject Category
Engineering (General)
Meeting Information
Meeting: International Microelectronics Assembly and Packaging Society (iMAPS) HiTECH 2021 Technology Crossover Extravaganza
Location: Online
Country: US
Start Date: April 26, 2021
End Date: April 29, 2021
Sponsors: International Microelectronics Assembly and Packaging Society (iMAPS)
Funding Number(s)
WBS: 427922.04.02.01
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
NASA Peer Committee
Keywords
DC Powered Oven
High Temperature Oven
Programmable Ramp Rate Oven
Software Routable Electrical Connections

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