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Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated CircuitsA scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.
Document ID
Document Type
Conference Paper
Alain Izadnegahdar
(Science Applications International Corporation (United States) McLean, Virginia, United States)
Stephanie L. Booth
(Glenn Research Center Cleveland, Ohio, United States)
David J. Spry
(Glenn Research Center Cleveland, Ohio, United States)
Philip G. Neudeck
(Glenn Research Center Cleveland, Ohio, United States)
Date Acquired
March 22, 2021
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: International Microelectronics Assembly and Packaging Society (iMAPS) HiTECH 2021 Technology Crossover Extravaganza 2021
Location: Online
Country: US
Start Date: April 26, 2021
End Date: April 29, 2021
Sponsors: International Microelectronics Assembly and Packaging Society (iMAPS)
Funding Number(s)
WBS: 427922.04.02.01
Distribution Limits
Public Use Permitted.
Technical Review
NASA Peer Committee
DC Powered Oven
High Temperature Oven
Programmable Ramp Rate Oven
Software Routable Electrical Connections
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