NTRS - NASA Technical Reports Server

As of October 27, 2023, NASA STI Services will no longer have an embargo for accepted manuscripts. For more information visit NTRS News.

Back to Results
A 96% Alumina based Packaging System for 500°C Test of SiC Integrated CircuitsWith the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.
Document ID
Document Type
Conference Paper
Liangyu Chen
(Ohio Aerospace Institute Cleveland, Ohio, United States)
Philip G Neudeck
(Glenn Research Center Cleveland, Ohio, United States)
David J Spry
(Glenn Research Center Cleveland, Ohio, United States)
Glenn M Beheim
(Glenn Research Center Cleveland, Ohio, United States)
Gary W Hunter
(Glenn Research Center Cleveland, Ohio, United States)
Date Acquired
April 15, 2021
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: International Conference on High Temperature Electronics (HiTEC) 2021
Location: Virtual
Country: US
Start Date: April 26, 2021
End Date: April 29, 2021
Sponsors: International Microelectronics Assembly & Packaging Society (iMAPS)
Funding Number(s)
WBS: 427922.04.02.01
Distribution Limits
Public Use Permitted.
Technical Review
Single Expert
High Temperature, Packaging, Alumina, Thick Film
No Preview Available