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Thermal Conductivity Estimation from Transient Test Data with Embedded Thermocouples using Genetic Algorithm OptimizationInverse heat transfer methodology previously developed to estimate thermal properties of high temperature fibrous insulation from embedded thermocouples was applied to the thermoplastic polymer, polyether-ether-ketone (PEEK). A small experimental setup was utilized to test the PEEK sample between temperatures of 300 K and 525 K at atmospheric pressure. Cylindrical plugs of PEEK with three thermocouples embedded at various depths were incorporated in the test sample. The experimental PEEK thermocouple data were used as the boundary and initial conditions of a one-dimensional numerical thermal model to predict the internal temperatures of the material. The thermal conductivity of PEEK was estimated with the Continuous Genetic Algorithm optimization technique by searching for the coefficients of a functional form of thermal conductivity that minimized the difference between the experimentally measured and model predicted internal temperature values. The thermal testing, one-dimensional numerical thermal model, optimization algorithm, analysis, and results are presented.
Document ID
20210014330
Acquisition Source
Langley Research Center
Document Type
Technical Memorandum (TM)
Authors
Elora Kurz
(Langley Research Center Hampton, Virginia, United States)
Kamran Daryabeigi
(Langley Research Center Hampton, Virginia, United States)
Date Acquired
April 23, 2021
Publication Date
May 1, 2021
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
NASA/TM-20210014330
Funding Number(s)
WBS: 321991.02.23.01
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
Thermal Properties
Optimization
Thermal Modeling
Thermal Testing
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