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Thermal Testing and Analysis Techniques for Wires and Wire BundlesDetermining wire and wire bundle amperage capacity (i.e., “ampacity”) currently relies on the use of standards to derate wire ampacity when in a bundle configuration. The feasibility of developing physics-based and regression thermal models of single wires and wire bundles to determine ampacity using a customized test apparatus was investigated during a pathfinder study. A test facility was developed and various wire and wire bundle articles were tested under a variety of temperature and pressure conditions using an efficient test matrix formulated using Design of Experiments (DOE) techniques. Physics-based models were developed and correlated to the test results. Regression models were formulated and compared to test results and standards.
Document ID
20210017684
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
S L Rickman
(Langley Research Center Hampton, Virginia, United States)
B I Furst
(Jet Propulsion Lab La Cañada Flintridge, California, United States)
K L Johnson
(Marshall Space Flight Center Redstone Arsenal, Alabama, United States)
Date Acquired
June 17, 2021
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: 8th European Thermal Sciences Conference (EUROTHERM 2021)
Location: Virtual
Country: US
Start Date: September 20, 2021
End Date: September 23, 2021
Sponsors: Langley Research Center
Funding Number(s)
WBS: 869021.01.23.01.01
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
Keywords
Thermal
Testing
Wires
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