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The Path Towards Realistic ASIC Deployment Into Previously Impractical Extreme Application Environments
Document ID
20220009309
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Philip G Neudeck (Glenn Research Center Cleveland, Ohio, United States)
David J Spry (Glenn Research Center Cleveland, Ohio, United States)
Michael J Krasowski (Glenn Research Center Cleveland, Ohio, United States)
Liangyu Chen (Ohio Aerospace Institute Cleveland, Ohio, United States)
Date Acquired
June 14, 2022
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: 80th Device Research Conference
Location: Columbus, OH
Country: US
Start Date: June 27, 2022
End Date: June 29, 2022
Sponsors: Materials Research Society
Funding Number(s)
WBS: 427922.04.10.01.03
Distribution Limits
Public
Copyright
Portions of document may include copyright protected material.
Technical Review
NASA Technical Management
Keywords
silicon carbide
JFET
Integrated Circuit
High Temperature

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