NTRS - NASA Technical Reports Server

Back to Results
Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment ApplicationsElectronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.
Document ID
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Liang-Yu Chen
(Ohio Aerospace Institute Cleveland, Ohio, United States)
Philip G. Neudeck
(Glenn Research Center Cleveland, Ohio, United States)
David J. Spry
(Glenn Research Center Cleveland, Ohio, United States)
Gary W. Hunter
(Glenn Research Center Cleveland, Ohio, United States)
Date Acquired
July 13, 2022
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2022)
Location: Oxford
Country: GB
Start Date: July 18, 2022
End Date: July 20, 2022
Sponsors: Presidio Components Inc.
Funding Number(s)
WBS: 427922.04.02.01
Distribution Limits
Public Use Permitted.
High temperature
electronic packaging
harsh environment
No Preview Available