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Thermal Conductivity of 3D Woven Composite Thermal Protection System
Materials via Multiscale Recursive Micromechanics
Multiscale micromechanics predictions have been made for the effective thermal conductivities and local thermal fields for a novel 3D woven composite thermal protection system material. The Multiscale Recursive Micromechanics approach, which enables micromechanics models to call other micromechanics models (or themselves recursively) to consider finer and finer length scales, has been employed. The multiscale model uses a recently developed version of the High-Fidelity Generalized Method of Cells micromechanics theory at each of three length scales. Results focus on the impact of the microstructural geometry representation at each length scale on the material’s effective thermal conductivity, along with the local thermal flux and temperature fields induced in the microstructures.
Document ID
20220011532
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Brett A Bednarcyk
(Glenn Research Center Cleveland, Ohio, United States)
Trenton M Ricks
(Glenn Research Center Cleveland, Ohio, United States)
Evan J Pineda
(Glenn Research Center Cleveland, Ohio, United States)
Pappu L N Murthy
(Glenn Research Center Cleveland, Ohio, United States)
Subodh K Mital
(University of Toledo Toledo, Ohio, United States)
Zhong Hu
(South Dakota State University Brookings, South Dakota, United States)
Peter A Gustafson
(Western Michigan University Kalamazoo, Michigan, United States)
Date Acquired
July 29, 2022
Publication Date
December 29, 2021
Publication Information
Publication: AIAA SCITECH 2022 Forum
Publisher: AIAA
Subject Category
Structural Mechanics
Meeting Information
Meeting: AIAA SCITECH 2022 Forum
Location: San Diego, CA / Virtual
Country: US
Start Date: January 3, 2022
End Date: January 7, 2022
Sponsors: American Institute of Aeronautics and Astronautics
Funding Number(s)
WBS: 335803.04.22.22.10.01
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
External Peer Committee
Keywords
composite
thermal conductivity
micromechanics
thermal protection systems
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