NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Feasibility of Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage ApplicationsThe newly patented micro-multilayer multifunctional electrical insulation (MMEI) system was developed for future electric aircraft applications which critically require lightweight but high voltage (HV), high temperature, and corona or partial discharge (PD) resistant insulation. During the initial development stages, the concept and practicability of the MMEI system were successfully validated with its exceptionally high dielectric breakdown voltages. The multilayer structures were optimized in terms of material type, individual layer thickness, and overall layer configuration along with potential mechanisms identified for its superior performance. Subsequently, scalability, manufacturability, and commercial applicability of the MMEI system were demonstrated with the 1 meter long, 3-phase HV, high power (HP) bus bar prototypes. Two prototypes, one with the conventional SOA insulation system including Mica sheet and the other with an optimized MMEI, were designed, fabricated, and tested successfully. Both prototypes passed both HiPot and PD tests up to the highest test voltage available, 15 kVAC, although the latter showed a slight increase in PD activities at 12.5 kV. However, the prototype with MMEI was 15% lighter or 12% thinner than the other one. Current efforts to significantly enhance the PD resistance of the MMEI system by employing semiconductive shielding layers, which can be also multifunctional, e.g., electromagnetic interference shielding, moisture blocking, heat dissipation, for various HV applications are also discussed in this paper.
Document ID
20230006503
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
E. Eugene Shin
(Universities Space Research Association Columbia, Maryland, United States)
Date Acquired
April 27, 2023
Subject Category
Aeronautics (General)
Chemistry And Materials (General)
Electronics and Electrical Engineering
Meeting Information
Meeting: 2023 IEEE Electrical Insulation Conference (EIC)
Location: Quebec City, QC
Country: CA
Start Date: June 18, 2023
End Date: June 22, 2023
Sponsors: Institute of Electrical and Electronics Engineers
Funding Number(s)
CONTRACT_GRANT: 80GRC020D0003
WBS: 109492.02.03.06.02.10
Distribution Limits
Public
Copyright
Public Use Permitted.
Patent
U.S. Pat. No. 10,546,666
Patent Application
Technical Review
Single Expert
Keywords
Novel Electrical Insulation
High Voltage
Lightweight
Mulilayer
Multifunctional
Semiconductive shield
No Preview Available