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Pt/HTCC Alumina Based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications
Document ID
20230013082
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Liangyu Chen (Ohio Aerospace Institute Cleveland, Ohio, United States)
Philip G Neudeck ORCID(Glenn Research Center Cleveland, Ohio, United States)
David J Spry (Glenn Research Center Cleveland, Ohio, United States)
Gary W Hunter (Glenn Research Center Cleveland, Ohio, United States)
Date Acquired
September 7, 2023
Publication Date
September 13, 2023
Subject Category
Electronics and Electrical Engineering
Meeting Information
Meeting: Northern California Chapter of the American Vacuum Society (NCCAVS) Joint User Group Meeting (CMPUG, PAG, & TFUG)
Location: Virtual
Country: US
Start Date: September 13, 2023
Sponsors: American Vacuum Society
Funding Number(s)
WBS: 427922.04.10.01.03
CONTRACT_GRANT: 80GRC020D0003
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
High temperature
electronic packaging
HTCC
Venus
SiC
harsh environment
500 °C

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