Innovations in Continuous Ultrasonic Welding of Thermoplastic Composites and Evaluation for Space Applications

The goals of NASA’s Thermoplastic Development for Exploration Applications (TDEA) Project include and assessment of thermoplastic composite joints for space structures by developing and maturing design capabilities, analysis tools and techniques, and manufacturing processes for thermoplastic composites. Through this effort the TDEA project will expand NASA’s in-house thermoplastic composite manufacturing capabilities, develop an understanding of advanced thermoplastic joining techniques relevant to space environments, evaluate the feasibility of reconfigurable composite structures, and advance structural analysis capabilities, including failure prediction of thermoplastic composites including joints.

This presentation will provide an overview of the materials and manufacturing effort within the TDEA project. Three semi-crystalline and one amorphous thermoplastic composite system were selected for initial screening and provided an opportunity to gain manufacturing experience across a range of processing temperatures, rheological behavior, and composite properties. Equivalency to the National Center for Advanced Materials Performance (NCAMP) test report for Toray’s TC1225 material was established to provide confidence in in-house manufacturing and material properties were generated through baseline mechanical tests for each material. Material characterization data was generated for a subset of materials to (1) provide data for analysis and model development and (2) generate thermal, rheological and conductivity data across relevant temperatures. A key objective of the TDEA project is evaluation of thermoplastic composite joining processes suitable for in-space operations. This presentation will outline the project’s progress in fusion bonding candidate materials by common welding techniques to assess the quality, reproducibility and strength of the bond, as well as identify limitations to in-space manufacturing. The feasibility of joint disassembly and reassembly will be discussed.