Icarus Application to Dragonfly Heatshield

Icarus, an in-house material response solver developed at NASA Ames, is applied to perform 2-D bondline-temperature analysis on the heatshield surface of the latest Dragonfly entry system design for a mission to Titan. Two axisymmetric domains are used: the near-shoulder region and the entire heatshield. The heatshield consists of a PICA TPS bonded to a layered system of Aluminum honeycomb wrapped by an M55J carbon-fiber facesheet. The backshell, which is also included for more accurate analysis, consists of similar materials layered. Icarus simulations using both domains indicate that the in-plane thermal conductivity property of the M55J facesheet is observed to play a dominant role in bondline temperature. Similarly, the maximum bondline temperature is found around the PICA-tile-interface region instead of the near-shoulder region or the stagnation point based on the current trajectory using the orthotropic properties of M55J. Therefore, these findings indicate the significance of 2-D or higher-dimensional material modeling analysis in fully understanding how bondline temperature behaves across the heatshield and obtaining a basis for TPS design locations. Verification at different radial locations ahead of the shoulder, where thermal conduction is close to 1-D, between Icarus (2-D), Icarus (1-D), and FIAT is performed and good agreement is observed. With the entire heatshield domain, the total mass loss of the aeroshell materials is approximately 3% of their initial mass potentially due to thermal decomposition of phenolic resins inside PICA under the current high-heating environment.