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Cold Electronics for Lunar Missions AppendicesNASA’s goal of developing crewed and robotic lunar installations has created a need for cold capable electronic parts, subsystems, and systems that can operate in the lunar thermal environment (typically -233 degrees Celsius (°C) or below to +125 ℃ ambient). This assessment was commissioned to evaluate the state of cold capable electronic and packaging technologies, perform a gap analysis against the continuous use of these electronics with minimal or no thermal management on the lunar surface, provide NASA Engineering and Safety Center (NESC) guidance on the qualification of cold electronics, and to give NESC recommendations for the development and utilization of cold capable electronics. The assessment did not focus on the lunar radiation environment. This document contains the appendices to the Volume 1 report.
Document ID
20250008584
Acquisition Source
Langley Research Center
Document Type
Technical Memorandum (TM)
Authors
George L Jackson
(Goddard Space Flight Center Greenbelt, United States)
Yuan Chen
(Langley Research Center Hampton, United States)
Raphael R Some
(Jet Propulsion Laboratory La Cañada Flintridge, United States)
Richard C Oeftering
(Glenn Research Center Cleveland, United States)
Mohammad M Mojarradi
(Jet Propulsion Laboratory La Cañada Flintridge, United States)
Erik J Brandon
(Jet Propulsion Laboratory La Cañada Flintridge, United States)
Linda Y Del Castillo
(Jet Propulsion Laboratory La Cañada Flintridge, United States)
Jean Yang-Scharlotta
(Jet Propulsion Laboratory La Cañada Flintridge, United States)
Date Acquired
August 20, 2025
Publication Date
August 1, 2025
Subject Category
Electronics and Electrical Engineering
Report/Patent Number
NASA/TM-20250008583/Volume 2
NESC-RP-23-01873
Funding Number(s)
WBS: 869021.01.23.01.01
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
NASA Peer Committee
Keywords
Cold Electronics for Lunar Missions
Lunar Surface Missions
Cold Electronics and Packaging Qualification
Cold Electronics and Packaging
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