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Sizing and Margin Methodology for Dual-Layer Thermal Protection SystemsThis presentation introduces a new sizing and margin methodology for dual-layer Thermal Protection Systems (TPS). The methodology has been tailored for application to a dual-layer 3D-woven TPS called Heat-shield for Extreme Entry Environments Technology (HEEET). Sizing is performed for a reference Saturn probe mission to show how uncertainties in trajectory, aerothermal modelling and TPS response impact the sizing of each layer.
Document ID
20180004051
Acquisition Source
Ames Research Center
Document Type
Presentation
Authors
Mahzari, Milad
(NASA Ames Research Center Moffett Field, CA, United States)
Milos, Frank S.
(NASA Ames Research Center Moffett Field, CA, United States)
Date Acquired
July 31, 2018
Publication Date
June 12, 2018
Subject Category
Spacecraft Design, Testing And Performance
Report/Patent Number
ARC-E-DAA-TN57591
Meeting Information
Meeting: International Planetary Probe Workshop
Location: Boulder, CO
Country: United States
Start Date: June 11, 2018
End Date: June 15, 2018
Sponsors: Colorado Univ.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
Sizing
TPS
EDL
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