Influence of Fiber Content, Thermal Cycles and Creep on Electrical Resistivity Measurements of SiCf/SiC Minicomposites

Fiber-reinforced Ceramic Matrix Composites (CMCs) are currently being used in high-temperature applications such as jet engine components. In such extreme environment applications, materials are exposed to many mechanical and thermal loading cycles during the life of the component. This exposure can degrade the component, and thus, components need to be monitored and inspected during service. The electrical resistivity nondestructive evaluation technique has been shown to be very sensitive to damage in CMCs, and although its performance is highly dependent on temperature, this temperature-dependence is still not well understood. Therefore, this current study aims to establish the influence of thermal cycles, creep, CVI-SiC matrix cracks and fiber volume fraction on the electrical resistance of Hi Nicalon and Hi-Nicalon Type S SiC fiber-reinforced minicomposites with BN interphases. Minicomposites with 97% CVI-SiC matrix volume fraction were used to characterize the electrical resistivity of the CVI-SiC matrix. Next, models were constructed to calculate fiber resistivity and onset and evolution of damage during tensile testing at room-temperature. The thermal cycles were achieved by heating as-received and precracked specimens to 1200°C and then cooling them to room temperature, with or without applied stress on fibers.