Integration of Multilevel Superconducting Buried Wiring Layers with Transition-Edge Sensor Detectors for Large Scale Arrays

Lynx, one of the four mission concepts under consideration for the next Astrophysics DecadalReview, will include a microcalorimeter array consisting of more than 100,000 pixels in a compact arrangement with absorber pitch as small as 25 microns. In order to realize the desired array scale, fine-pitch multi-level superconducting wiring with high yield, compatible with rapid expansion of our hydra absorber designs, is essential. We have demonstrated a method of integrating transition edge sensor (TES) microcalorimeters with suitable multilevel buried wiring, fabricated at MIT Lincoln Laboratory using advanced tools dedicated to superconducting circuit fabrication. The TES Mo/Au bilayer is deposited on a high-quality oxide surface created by chemical-mechanical polishing, allowing tight specifications on the TES superconducting transition and link conductivity to be achieved even though the process order has been inverted. The TESs contact the top-level niobium wiring through vias etched through silicon dioxide down to the topmost wiring layer. The article discusses the overall fabrication process, as wellas the behavior of sensors with different via designs, proximity structures, and lateral sizes. An initial iteration of the integrated fabrication process indicates that microcalorimeters fabricated in this way should meet mission specifications using a Mo/Au bilayer with a reasonable critical temperature below 100 mK.