Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Philip G. Neudeck (Glenn Research Center Cleveland, Ohio, United States) David J. Spry (Glenn Research Center Cleveland, Ohio, United States) Michael J. Krasowski (Glenn Research Center Cleveland, Ohio, United States) José M. Gonzalez (HX5, LLC) Srihari Rajgopal (Glenn Research Center Cleveland, Ohio, United States) Norman F. Prokop (Glenn Research Center Cleveland, Ohio, United States) Lawrence C. Greer (Glenn Research Center Cleveland, Ohio, United States) Shamir Maldonado-Rivera (Glenn Research Center Cleveland, Ohio, United States) Christina M. Adams (Glenn Research Center Cleveland, Ohio, United States) Date Acquired
April 10, 2023
Subject Category
Electronics and Electrical EngineeringSolid-State Physics Meeting Information
Meeting: International Conference and Exhibition on High Temperature Electronics (HiTEC)
Location: Albuquerque, NM
Country: US
Start Date: April 18, 2023
End Date: April 20, 2023
Sponsors: Materion (United States)
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
NASA Technical Management
Keywords
Silicon CarbideIntegrated CircuitJFETInterconnectSiC